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Thermal Research Architect
| Company | Meta |
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| Location | Redmond, WA, USA |
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| Salary | $170000 – $240000 |
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| Type | Full-Time |
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| Degrees | Bachelor’s, PhD |
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| Experience Level | Senior, Expert or higher |
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Requirements
- BS in Physics, Chemistry, Material Science, Chemical, Material, or Mechanical Engineering, or similar discipline
- 8+ years of experience with project leadership in a research or advanced product development environment
- 5+ years of experience with Finite Element Analysis, Computational Fluid Dynamics (COMSOL, ANSYS, FloEFD) and Computer-Aided Design (Solidworks, CREO, NX) or similar tools
- 5+ years of experience with system and/or sub-system thermal simulation, analysis, and solution development, from concept to production, for high volume consumer electronics devices
- Experience with various manufacturing methods, from rapid prototyping to high-volume manufacturing
Responsibilities
- Lead a research team to develop advanced thermal management solutions for next generation Extended Reality devices, from concept to prototype
- Define a thermal management research roadmap and drive execution with leading research and manufacturing partners
- Transfer promising technologies from Research to Product support New Technology Introduction and New Product Introduction projects
- Manage a thermal research laboratory
- Lead capital project planning, execution, and lab safety
- Develop thermal Finite Element Analysis and Computational Fluid Dynamics models and run simulations using Ansys, COMSOL, or similar software Use simulation to inform research roadmap and guide project execution
- Develop thermal test beds, data acquisition systems, and processes to characterize thermal management materials, devices, and systems
- Run experiments, analyze data, document results, and present conclusions and recommendations in research meetings
- Recommend design changes/directions to meet device performance requirements, participate in team brainstorming and new technology development
Preferred Qualifications
- PhD in Physics, Chemistry, Material Science, Chemical, Material, or Mechanical Engineering, or similar discipline
- Experience with thermal design of printed circuit boards, flex circuits, thermal interface materials, digital chips/device, heatsinks and other active/passive cooling solutions
- Experience developing passive thermal management solutions using compliant materials such as aerogels, graphite heat spreaders, phase change materials, metamaterials, radiation coatings
- Experience developing relationships, scoping and lead engagements with academic and industrial research and manufacturing partners (OEMs, CMs)
- Experience with bioheat transfer (e.g., Pennes Bio-Heat equation) and thermal management for wearables, including moisture/humidity simulation and analysis
- Familiarity with Labview or Minitab
- Experience with Statistical analysis of fit and wearability for population extremes 95/5
