Thermal Engineer – Systems Engineering
| Company | Qualcomm |
|---|---|
| Location | Austin, TX, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | Master’s, PhD |
| Experience Level | Senior, Expert or higher |
Requirements
- Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
- 5+ years of hands-on experience in thermal modeling within the high-tech industry.
- Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.
- Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
- Understanding of electronics cooling technologies (passive and active).
- Knowledge of packaging technologies, server design, and thermal management materials.
- Proven ability to work independently and collaboratively within a cross-functional team environment.
- Strong technical documentation skills and excellent written and verbal communication.
Responsibilities
- Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.
- Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.
- Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.
- Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.
- Research thermal management materials and solutions for advanced electronics.
- Develop and maintain documentation, guidelines, and tools to support design processes and project success.
- Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.
Preferred Qualifications
- Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
- 10+ years of hands-on experience in thermal modeling within the high-tech industry.
- Understanding of OCP product designs and industry best practices.
- Engineering design and industry experience with high-end servers.
- Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak).
- Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware.
- Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.
- Experience with CAD tools (e.g., SolidWorks, Creo).