Thermal Analysis Engineer III – Lunar
Company | Blue Origin |
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Location | Seattle, WA, USA, Los Angeles, CA, USA, Denver, CO, USA |
Salary | $107707 – $164497 |
Type | Full-Time |
Degrees | Bachelor’s, Master’s, PhD |
Experience Level | Senior |
Requirements
- Minimum of a B.S. degree in mechanical or aerospace engineering
- 5 years of relevant Thermal Analysis experience
- Established understanding of heat transfer fundamentals in space environment
- Good understanding of common spacecraft thermal hardware
- Understanding of aerospace hardware verification and validation process
- Ability to earn trust, maintain positive and professional relationships, and contribute to a culture of inclusion.
- Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Responsibilities
- Own the delivery and quality of thermal analysis of one or more spacecraft systems/components, often including the work of several contributing analysts
- Build thermal models in Thermal Desktop (for system-level) or ANSYS Icepak (for component-level) based on system inputs from external teams
- Predict spacecraft and part temperatures across all mission phases
- Identify non-compliances to thermal requirements and drive them to resolution
- Perform trade studies and optimizations of thermal design solutions and collaborate with external IPTs on the trade offs
- Document thermal analysis results and present at program gated reviews
- Lead and mentor early-career thermal engineers
Preferred Qualifications
- M.S. or PhD degree in mechanical or aerospace engineering
- 7 years of relevant Thermal Analysis experience
- Strong understanding of pumped fluid loop hardware such as pumps, cold plates, radiators, valves, heat exchangers, etc and semi-passive devices like sensors and heaters
- Familiar with thermal environments of lunar missions
- Experience solving a variety of thermal problems demonstrating breadth in application
- Expert in Thermal Desktop and Sinda/Fluint, including model validation and test correlation
- Expert in ANSYS Icepak, including printed circuit board modeling