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Thermal Analysis Engineer III – Lunar

Thermal Analysis Engineer III – Lunar

CompanyBlue Origin
LocationSeattle, WA, USA, Los Angeles, CA, USA, Denver, CO, USA
Salary$107707 – $164497
TypeFull-Time
DegreesBachelor’s, Master’s, PhD
Experience LevelSenior

Requirements

  • Minimum of a B.S. degree in mechanical or aerospace engineering
  • 5 years of relevant Thermal Analysis experience
  • Established understanding of heat transfer fundamentals in space environment
  • Good understanding of common spacecraft thermal hardware
  • Understanding of aerospace hardware verification and validation process
  • Ability to earn trust, maintain positive and professional relationships, and contribute to a culture of inclusion.
  • Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

  • Own the delivery and quality of thermal analysis of one or more spacecraft systems/components, often including the work of several contributing analysts
  • Build thermal models in Thermal Desktop (for system-level) or ANSYS Icepak (for component-level) based on system inputs from external teams
  • Predict spacecraft and part temperatures across all mission phases
  • Identify non-compliances to thermal requirements and drive them to resolution
  • Perform trade studies and optimizations of thermal design solutions and collaborate with external IPTs on the trade offs
  • Document thermal analysis results and present at program gated reviews
  • Lead and mentor early-career thermal engineers

Preferred Qualifications

  • M.S. or PhD degree in mechanical or aerospace engineering
  • 7 years of relevant Thermal Analysis experience
  • Strong understanding of pumped fluid loop hardware such as pumps, cold plates, radiators, valves, heat exchangers, etc and semi-passive devices like sensors and heaters
  • Familiar with thermal environments of lunar missions
  • Experience solving a variety of thermal problems demonstrating breadth in application
  • Expert in Thermal Desktop and Sinda/Fluint, including model validation and test correlation
  • Expert in ANSYS Icepak, including printed circuit board modeling