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Sensing HW & Data Collection Systems – Mechanical Engineer

Sensing HW & Data Collection Systems – Mechanical Engineer

CompanyApple
LocationCupertino, CA, USA
Salary$121900 – $183600
TypeFull-Time
DegreesBachelor’s
Experience LevelJunior

Requirements

  • BS in mechanical engineering with at least 1+ year of relevant internship or industry experience in relevant field.
  • Proficiency in 3D CAD and creating 2D manufacturing drawings.
  • Strong mechanical engineering including analytical skills, material selection, and manufacturing processes based on engineering requirements.
  • Excellent written and verbal communication skills and people skills; ability to interact with management, team members and external vendors.

Responsibilities

  • Developing mechanical design of systems using 3D CAD, ensuring robustness and manufacturability.
  • Creating and evaluate proof-of-concepts, working with machine shops and vendors for fabrication.
  • Plan and perform design validation, including thermal analysis and reliability testing.
  • Supporting assembly and integration processes, for internal engineering build or directing external contract manufacturers, and performing rapid failure analysis to mitigate risks and maintain project timelines.
  • Collaborate multi-functionally to define and refine design, testing, and validation requirements, aligning with user specifications and operational needs.
  • Up to 20% domestic and international travel.

Preferred Qualifications

  • MS in mechanical engineering.
  • Fluent in Siemens NX and familiarity with flexible and rigid printed circuit boards design, fabrication and assembly.
  • Experience with thermal management, and optical, force, touch sensing technologies is a plus.
  • Hands-on experience integrating electronics, sensors and cameras to satisfy challenging packaging constraints.
  • Deep understanding of real-world manufacturing and quality control processes including IQC, IPQC, tolerance analysis, DFM/DFA, and GD&T.