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Senior Thermal Mechanical Engineer

Senior Thermal Mechanical Engineer

CompanyPsiQuantum
LocationPalo Alto, CA, USA
Salary$130000 – $170000
TypeFull-Time
DegreesBachelor’s, Master’s, PhD
Experience LevelSenior

Requirements

  • B.Sc., M.Sc., or Ph.D in Mechanical Engineering, Aerospace Engineering, Nuclear Engineering, or Physics.
  • Software tools – Mathcad, Matlab, IcePak, ANSYS Workbench, Fluent, SpaceClaim, Solidworks, NX.
  • Demonstrated use of advanced analysis tools to solve thermal/fluid challenges with respect to optical and electronic assembly at the appropriate level of detail – Finite Element Analysis (FEA) and Fluid Dynamics (CFD).
  • Solid understanding of and experience matching thermal models to experiment results.
  • Thoroughly documenting design inputs and outputs.
  • Ability to adapt changes and handle multiple assignments.
  • Excellent written and verbal communication skills.

Responsibilities

  • The Thermal Mechanical Engineer focuses primarily on the highly integrated electronic optical assembly to support quantum computer.
  • Applying knowledge of heat transfer, fluid mechanics, and structural mechanics to the development of optical electronics assembly under cryogenic condition.
  • Develop methodologies for chip power modeling and measurement, characterization of power features, correlate chip behavior with simulations and provide design feedback.
  • Analyzing field issues related to electronic optical assembly design and providing solutions where required.
  • General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses.
  • Assisting and/or directing vendors to develop necessary manufacture process.
  • Actively participating in cross functional project teams through all phases of product development to ensure successful execution of innovative and best-in-class designs.

Preferred Qualifications

  • Experience with multiple material performance, design constraints, and manufacture constraints under cryogenics condition.
  • Knowledge of common optical system specifications and optical component specifications.
  • Experience in feeding thermal model results into structural models to determine optical component movements/deformations (STOP analysis).
  • Exposure to CPU/GPU/SoC architecture and HW-SW co-design is a plus.