Senior Thermal Engineer

MS Degree in Mechanical Engineering – Ph.D. preferred.
Minimum of 5 years of direct professional experience in thermal design and analysis of electronic appliances using Icepak, FloTHERM, SmartCFD, etc.
Experience with high power (>800W) SoC liquid cooling thermal models and system-level analysis.
Experience in cold plate liquid cooling design and analysis, open loop or closed loop liquid cooling, CDU at rack level or facility level design and analysis.
Experience in numerical modeling based on Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) (convergence, discretization, meshing).
Knowledge and familiarity with electronic cooling and challenges of systems within data center environments.
Knowledge of heat transfer modes; conduction, convection (passive and active), and radiation.
Thorough understanding of heat sink type/design, heat pipes, vapor chambers, fans, blowers, pumps, thermal interface material. Experience in vendor selection.
Flow and thermal measurement techniques, mechanical (thermal and structural) validation and qualification tests including, Environmental Test (ETE), etc.
Knowledge of thermal airflow testing, fans, pumps, liquid loop cold plate testing, and augmentation to system thermal simulation models.
Experience using ProEngineer (PTC Creo) a plus.
Good verbal and written communication skills.

Develop thermal cooling strategies for next-generation, high-performance switching products.
Work independently to perform complete thermal analysis and design using Icepak.
Support thermal analysis requests from hardware team, product management team and other cross functional teams with either spreadsheet calculations or detailed simulation results.
Capable of conducting different engineering experimental tests to verify design (e.g., components, system level, etc.) and correlate with computational results.