Senior Packaging Engineer

Master’s degree in Materials Science and Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields.
Strong background in power electronics, electrical engineering, and materials science.
In-depth knowledge and experience in power module design, optimization, and manufacturing.
Experienced in inductor design, construction, and material selection.
Experienced in electrical simulation tools, such as, Ansys Q3D and Ansys Maxwell.
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

Power module development: design, simulate, optimize, and qualify power module products.
Business Unit (BU) communications: good communication skills are needed to understand the package requirements and to influence package-related design decisions for new product development.
Assembly subcontractor/OSATs communications: work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls and oversea travels are expected.
Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support.
Project management: plan and drive for on time delivery of development projects.
Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
Package process development: experience in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).