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Senior ECAD Board Layout Engineer
Company | RTX |
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Location | Tewksbury, MA, USA |
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Salary | $82000 – $164000 |
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Type | Full-Time |
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Degrees | Bachelor’s, Master’s |
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Experience Level | Senior |
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Requirements
- Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience, or an Advanced Degree in a related field and minimum 3 years of experience to include at least two (2) of the following: Previous work history with PCB manufacturing or CCA manufacturing principles that affect circuitry and component layout along with RF specific layout techniques, Experience with the electrical design process including RF layout, History with laying out Rigid, Flex, or Rigid-Flex boards
- The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.
Responsibilities
- Responsible for Printed Circuit Board (PCB) designs from conception to manufacturing
- Creation of the PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliers
- Schematic Capture, Component Placement, Routing of Traces, Gerber/ODB++ file creation
- Utilizing software such as Siemens: Xpedition Enterprise and DownStream Technologies: BluePrint-PCB
- Design layouts include Rigid, Flex, and Rigid-Flex assemblies
- Work designs include full designs, re-spins, drawing updates, change notices, copper changes, and process improvement projects within and outside own discipline
- Daily interface with various engineering levels along with different engineering disciplines including, but not limited to Electrical, Mechanical, Components, Test, and Producibility Engineering disciplines to ensure that the overall design requirements are captured, keeping cost, cycle time, and producibility in mind.
Preferred Qualifications
- Working knowledge of Analog, Digital including DDR, specific experience with RF, Power, and mixed technology, including multi-layer designs with High Density Interconnect (HDI) technology
- Technical PCB design skills using the Siemens design toolset including, but not limited to the Xpedition Layout tool suite with working knowledge of schematic capture, placement, routing, use of the auto-router, constraint manager, and library tools, and use of BluePrint to create complex PCB and CCA drawings, Altium is not used, but transfers over well to the Siemens toolset
- Export manufacturing data in both Gerber and ODB++ formats
- Use of Valor NPI, Design for Manufacturing rule sets, other Design Rule Checking software
- Able to understand and interpret drawings as they relate to PCB’s and CCA’s
- Familiarity with IPC 6012 & IPC 6013
- Working knowledge of military and commercial design standards, GD&T techniques, and overall producibility considerations related to electronic packaging
- Knowledge of RF circuitry and key care abouts when it come to laying out the board along with filter knowledge
- Working knowledge of operating system concepts and implementations, network services as related to Microsoft Windows suites
- Willingness to work extended hours (nights and/or weekends) as required to complete assigned tasking
- Active Secret DoD security clearance