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Semiconductor Backside Via Process Lead

Semiconductor Backside Via Process Lead

CompanyRTX
LocationAndover, MA, USA
Salary$82000 – $164000
TypeFull-Time
DegreesBachelor’s
Experience LevelSenior

Requirements

  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience, or an advanced degree in a related field and minimum 5 years’ experience in Engineering/other technical positions.
  • Experience in semiconductor processing techniques including photolithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections.
  • The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

Responsibilities

  • Sustainment of current deposition production processes and involvement with development of new process
  • Set and report center priorities at the 8am foundry tier meeting
  • Identify process improvement opportunities
  • Lead 8Ds and RCCAs
  • Create, document, maintain and approve work instructions
  • Assist process engineers in training users and operators on semiconductor processes and equipment
  • Manipulate large datasets and use statistical analysis to define SPC controls, manage projects, and assign risk
  • Develop and report on actionable deposition work center health metrics
  • Identify capital needs, collaborate with tool vendors, assist in tool acceptance, and create plans/schedules for tool and process qualifications
  • Frequently work on the foundry floor and interact with various process engineering, equipment engineering, digital technologies, quality, facilities, and operation teams

Preferred Qualifications

  • Knowledge of multidisciplinary semiconductor processes, tool health monitoring, uniformity controls, SECS/GEM experience, and proficient in statistical process control
  • Excellent communication skills to effectively transfer ideas
  • Broad knowledge related to semiconductor processing, device physics, and data analysis
  • Experience troubleshooting a wide set of fabrication equipment in addition to establishing equipment qualification and preventative maintenance procedures
  • Experience in a data analysis software packages (e.g. MATLAB, Python, SQL, JMP)
  • Ability to lead and coordinate technical projects with cross-functional teams
  • Experience with characterizing, understanding, and improving semiconductor device performance and reliability