Principal/ Senior Principal Electromechanical Design Engineer
| Company | Northrop Grumman |
|---|---|
| Location | Halethorpe, MD, USA |
| Salary | $105400 – $196700 |
| Type | Full-Time |
| Degrees | Bachelor’s, Master’s, PhD |
| Experience Level | Senior, Expert or higher |
Requirements
- Bachelor’s degree with 5 years of experience, a master’s degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate/PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD and/or Xpedition software
- Familiarity with NX or other 3D modeling software
- Bachelor’s degree with 8 years of experience, a master’s degree with 6 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
- Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate/PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD and/or Xpedition software
- Familiarity with NX or other 3D modeling software
Responsibilities
- Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
- Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing
- Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints
- Providing technical leadership and mentoring to less experienced personnel
Preferred Qualifications
- Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields
- Active DoD Secret Clearance or higher
- Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools
- Experience with hands-on assembly and testing of prototype electronic hardware
- Experience in a technical leadership role on a cross-functional product development team
- Experience routing RF signals