Principal / Senior Principal Defect Characterization and Analysis Engineer

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 5 years of semiconductor fabrication experience or a Master’s degree with 3 years of experience or PhD with 0 years
Hands-on and moderate understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
Hands-on and basic understanding of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Familiar with semiconductor processing areas
In depth knowledge of statistical process control
In depth knowledge of Root Cause and Corrective Action Analysis for inline defectivity
Hands on experience with 6- and 8-inch Silicon substrates
Ability to work in a cleanroom setting
Ability to obtain and maintain a Secret clearance
US citizenship required

Monitoring and reporting baseline defectivity across a variety of inspection and review toolsets
Analyzing and leading defect partition experiments
Analyzing and presenting split results
Reviewing and correcting defect classification
Training engineers and technicians in defect classification and analysis

Experience leading defect excursion and root cause analysis including Six Sigma practices
Led defect partitions improving overall yield
Capable of setting up and piloting defect inspection and analysis with new product technology lines
Experience in lean manufacturing practices and structured problem-solving methodology
Experience working in a cleanroom setting
Data analysis and visualization (JMP)
JMP and Python scripting
Experience developing technical specifications for equipment procurement
Strong module leadership and regular reporting experience with stakeholders of various backgrounds
Active Secret clearance