Principal Mechanical Engineer

Principal Mechanical Engineer

Requirements

• BSME in Mechanical Engineering
• 8-10 years of experience in Telecommunications Electronic Packaging
• Experience in low volume fabrication techniques (3D printing, CNC Machining, & Cable Harnesses)
• Experience in high volume fabrication techniques (including plastics, die castings, extrusions, sheet metal, & elastomers)

Responsibilities

• Responsible for engineering mechanical solutions to electronic packaging challenges at the chip level, board level, enclosure level, and Data Center level.
• Design and develop custom indoor and outdoor enclosures to include protecting custom circuit board designs from harsh environments.
• Participate in the full product life cycle from Concept Industrial Design, Analysis, CAD Development, Prototyping, Testing, Production Release, and ongoing Production Support.
• Conduct design reviews and be accountable for meeting cost goals & schedule milestones.
• May be responsible for technical direction and mentoring of junior mechanical engineers.

Preferred Qualifications

• MSME in Mechanical Engineering
• Ability to work well with multi-disciplined engineering teams, including Digital EE’s, RF EE’s, & MFGR Engr’s.
• Expert knowledge of 3D CAD System CREO is a must.
• Experience performing Thermal Analysis & Structural Analysis is preferred.
• Knowledge of environmental test standards MIL-STD-810 & DO-160 is preferred.
• Experience designing mobile communication systems on air, land or sea vehicles is preferred.
• Technical awareness of UL safety standards, EMI/EMC standards, and design techniques to achieve compliance is preferred.
• Familiarity with DFMA & DFMEA is preferred.
• Project lead & Project management experience is preferred.
• Well spoken, self-starter, with high energy level & motivation to succeed.