Principal Engineer-Failure Analysis – Tem
| Company | Microchip Technology |
|---|---|
| Location | Tempe, AZ, USA, Chandler, AZ, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | Master’s, PhD |
| Experience Level | Senior, Expert or higher |
Requirements
- MS or PhD in Materials Science, Chemical Engineering, Physics, or equivalent with 7+ years of experience and 5+ years of experience in the semiconductor industry.
- Proficiency in TEM, SEM, FIB, and EDS.
- Comfortable with UNIX-based CAD navigation and basic circuit analysis.
- Familiarity with electrical FA/Fault Isolation tools and techniques.
- Strong understanding of semiconductor fabrication and packaging processes.
- Ability to interpret data and make sound hypotheses on defect mechanisms.
- Familiarity with sample preparation techniques including decapsulation, milling, and polishing.
- Knowledge of other FA techniques like X-ray, C-SAM, and Optical Microscopy.
Responsibilities
- Perform detailed failure analysis using TEM, SEM, FIB, and EDS.
- Utilize UNIX-based CAD navigation tools to review device layouts and conduct basic circuit analysis.
- Interface with requestors to review and ensure all appropriate information is provided for analysis requests.
- Apply electrical FA/Fault Isolation tools and techniques to identify and analyze defects.
- Interpret data to formulate sound hypotheses on defect mechanisms.
- Conduct sample preparation techniques including decapsulation, milling, and polishing.
- Utilize other FA techniques such as X-ray, C-SAM, and Optical Microscopy.
Preferred Qualifications
- Excellent communication and interpersonal skills.
- Strong analytical and problem-solving abilities.
- Ability to work independently and as part of a team.