Package/System Design Engineer - Packaging Engineering

Package/System Design Engineer – Packaging Engineering

Experience in IC package, SIP module and/or PCB selection, design and layout.
Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs.
Experience in IC, package, PCB co-design for system performance optimization.
Hands on experience with Cadence SIP and/or Mentor Xpedition.
Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with assembly and substrate manufacturing process is a plus.
Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis.
Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory.

Package selection, package design, and/or package EE modeling.
Optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network, Mechanical and thermal constraints.
IC top level floor-planning including hard macro block placement, padring, RDL and bump pattern/assignment.
System level co-design methodology of IC, Package and PCB/Board.
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost.
Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs.
Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels.
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products.