Package Development – Signal Integrity and Power Integrity Engineer – Staff
| Company | Marvell |
|---|---|
| Location | Santa Clara, CA, USA |
| Salary | $105470 – $158000 |
| Type | Full-Time |
| Degrees | Bachelor’s, Master’s, PhD |
| Experience Level | Senior |
Requirements
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 – 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
- Strong fundamentals in EM, transmission lines and microwave theory
- Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
- Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
- Familiarity with IC package layout tools like APD or PADS
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python
- Working knowledge of circuit design tools: Spectre, ADS, HSpice
- Experience with VNA and TDR measurements for package and PCB characterization
- Frequency domain and time domain knowledge of high speed signaling
- Experience with high-speed electronic packaging for digital and analog ICs
- Power plane design, modeling and analysis using tools like PowerSI, SIwave
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
- Understanding, debugging and simulations of EMI/EMC problems
- A team player
- Strong communication, presentation, and documentation skills
Responsibilities
- Package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.
- Interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
- Interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Preferred Qualifications
- Experience with 2.5D/3D package development is highly desired.
- Track record of new product introduction from concept, through development and production is a plus.
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
- Experience with channel simulations using MATLAB or ADS or other tools is a plus.