Microelectronics Failure Analysis Scientist
| Company | The Aerospace Corporation |
|---|---|
| Location | El Segundo, CA, USA |
| Salary | $117300 – $175900 |
| Type | Full-Time |
| Degrees | PhD |
| Experience Level | Senior |
Requirements
- PhD in electrical engineering, computer engineering, materials science, or physics is required
- (6) or more years of progressively responsible professional scientific research experience is required
- Experience with semiconductor foundry service, microelectronics processing, semiconductor physics, and microelectronics packaging techniques
- Knowledge of physical analysis and fault isolation techniques such as electron microscopy, thermal imaging, focused ion beam, scanning/Transmission electron microscopy (S/TEM), or electron beam induced current (EBIC) imaging
- Experience with Python / LabVIEW / MATLAB or similar software for data collection/analysis
- Willing to travel domestically up to 10% of the year to customer site/conferences
- This position requires the ability to obtain and maintain a security clearance, which is issued by the U.S. government. U.S. citizenship is required to obtain a security clearance.
Responsibilities
- Provide technical support to national security space programs, internal, and academic collaborators
- Conduct research on microelectronic device technologies for application in space systems, including developing new physical analysis techniques and developing knowledge of hardware security verification
- Perform failure analysis and anomaly resolution investigations of integrated circuits and other microelectronic devices using physical analysis techniques such as electron microscopy, focused ion beam, and electron beam induced current imaging
- Present results of assessments/research internally, to customers, at scientific meetings, and publish research in refereed scientific journals
- Support the adoption and assessment of new technologies and applications, space systems, including technology qualification and assurance
- Develop capabilities in circuit & device modeling and materials physics simulation
Preferred Qualifications
- Strong publication record and demonstrated ability to develop and execute innovative research projects especially those related to microelectronics is strongly preferred
- Experience with semiconductor integrated circuits layout and design, PDK, DRC, VLSI, DFM, VLSI, architecture, BEOL technologies, 3D/advanced chip packaging techniques is highly desired
- Experience with VHDL/Verilog/FPGA/Microprocessor programming
- Understanding of circuit edit techniques or microelectronic hardware security