Mechanical Engineer III

Strong working knowledge of packaging electrical components like printed circuit boards, connectors, cables in rugged environments including ground and aerospace applications.
A bachelor’s degree in mechanical engineering (BSME) required, with a strong understanding of electronics packaging concepts.
10 years of experience in an engineering and manufacturing environment.
Proven experience in solving packaging challenges for printed board assembly designs in demanding ground and aerospace environments.
Demonstrated CAD proficiency, particularly in Autodesk Inventor or Solidworks and ASMEY14.5-2018 and geometric dimensioning and tolerancing (GD&T) standards.
Demonstrated knowledge of strength of materials, vibration, and fatigue. Ability to analyze and understand results and implement design changes to improve structural performance of electronic systems. This includes proficiency in FEA software, particularly ANSYS Mechanical, to perform modal, random vibration, shock, and other structural analyses.
Demonstrated knowledge of heat transfer mechanisms and principles to analyze, understand results and implement design changes to improve thermal performance of electronic systems. This includes familiarity in Autodesk CFD software package or similar, to perform conduction and convection thermal analyses.
Ability to multitask effectively in a work environment with shifting priorities.
Excellent oral, written, and interpersonal skills.

Work closely with cross functional teams to develop new products.
Reviews project progress with management to ensure that the product meets designs goals and timeline.
Train and mentor one or more junior engineers, fostering their growth.
Design packaging for electronic components like printed circuit boards, connectors, cables for use in rugged environments including laboratory, terrestrial and aerospace applications.
Plan and collaborate with the electrical engineering team to create multiple variations of existing and new products.
Ensuring the new design will survive in rugged environments.
Provide mechanical packaging concept and feasibility study at proposal stage.
Design thermal management solutions for electronic components.
Create detailed drawings for fabrication purposes.
Perform tolerance studies to ensure worst case conditions do not impede performance.
Perform printed circuit board level and system level structural analysis and fatigue analysis.
Perform printed circuit board level and system level thermal analysis for conduction and convection cooled products.
Lead the mechanical engineering design process, from concept to prototype through testing and troubleshooting.
Develop product test plans for both informal and formal design testing.
Experience in Design for Manufacturability and Assembly (DFM/DFMA).
Strong drafting skills with experience/knowledge in assembly tooling, fixture design.
Support new design handoff to production environment.