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Lead Principal Engineer – Connectivity

Lead Principal Engineer – Connectivity

CompanyHARMAN International
LocationNovi, MI, USA, Sunnyvale, CA, USA
Salary$142500 – $209000
TypeFull-Time
DegreesMaster’s
Experience LevelExpert or higher

Requirements

  • 10+ years in wireless system development for Automotive or IoT.
  • 5+ years automotive program experience, ideally car marker experience who could provide OEM use case aspect.
  • Master or above of Electronics or computing Engineering
  • Skilled in Wireless & RF system concept inc. V2X, Cellular (LTE, 5G) and network.
  • Experience in define system requirements, feature, use case for product definition.
  • Strong communication and presentation skills and capabilities for OEM customer technical discussion and presentation.
  • Broad technical and methodical knowledge
  • Ability to engage and involve stakeholders, spread globally, for concept collaboration.
  • Willing to travel to customers and business partners and other SBU locations per business need.

Responsibilities

  • Support technology and OEM customer technical evaluations.
  • Assist in product and feature definition.
  • Contribute to the development of technology roadmaps, standards, and wireless/RF concepts.
  • Support business development and customer RFx activities.
  • Evaluate and prepare technical proposals.
  • Conduct benchmarking activities.
  • Collaborate with internal teams from various functions, including Antenna, Hardware, Mechanical, System and Software Architects, Product Management, Supply Chain, and Business Development.
  • Drive innovation of new wireless design approaches for upcoming connected vehicle feature and requirements.
  • Guide the team with skillset overlapping wireless elements and mechanical competence, accounting for vehicle architecture and mechanicals to provide optimal connectivity performance.
  • Evaluate market and technology trends and collaborate with Hardware and Mechanical team to optimize the design of the overall solution.
  • Collaboration with the external business partners in NA to lead the roadmap discussion and industry standards.
  • Support business activities including battleplan sessions and product strategy with business development and CAM team.
  • Implement and facilitate PoC/ technical evals and demos with customers to showcase Harman capabilities.
  • Drive and support customer RFI/RFQ engagements in NA area in close collaboration with Product Management, Business Development and CAMs.
  • Drive the cost optimization ideas and concept from overall system aspect and use case aspect.
  • Lead the product benchmarking activities including evaluation against industry standards.
  • Provide SME view to the product management teams to address industry and market trends, as well as introduction of new technologies and features.
  • Drive and closely collaborate with Wireless module team to work on platform approach of reusable wireless components that can be used for future programs.

Preferred Qualifications

  • Experience leading global and virtual teams
  • Experience from OEM
  • Members of wireless standard (such as 3GPP, 5GAA etc.)
  • Additional language skills.