Interconnect and Integrated Devices Group Lead

Interconnect and Integrated Devices Group Lead

Requirements

• At least 2 years of experience in a role involving leadership of highly trained technical staff.
• Demonstrated experience with successful resource allocation and management of technical projects.
• More than 7 years of experience in one or more of: material properties of insulators when operating at cryogenic temperatures; material properties of metals when operating at cryogenic temperatures; photonic, RF, integrated circuit design.
• Must have authored scientific publications and given technical presentations.
• Proficiency in use of computers, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
• Ability to work well in a team and independently.

Responsibilities

• Managing resources (e.g. allocating team personnel to projects).
• Talent acquisition (e.g. recruiting).
• Performance management through informal and formal feedback.
• Providing critical feedback to staff.
• Collaboration with senior management to develop lab-wide strategy.
• Creating and managing work plans to meet or exceed schedule deadlines.
• Providing written and oral summaries of work performed as needed (e.g. for reports).

Preferred Qualifications

• Experience with proposal writing and program management is desired.
• In-depth knowledge of advanced materials, device design, and fabrication is desired.
• In-depth knowledge of active passive photonic or RF component integration through various platform is desired.
• Strong desire to learn new technologies and flexibility to change from one project to another quickly.
• Strong technical writing, proposal, presentation, and general communication skills are desired.