Hardware – Engineering Internship – CPU – Gpu – SoC – Digital Design – DV
| Company | Qualcomm |
|---|---|
| Location | Austin, TX, USA, Santa Clara, CA, USA, Boxborough, MA, USA, Boulder, CO, USA, San Diego, CA, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Internship |
| Degrees | Bachelor’s, Master’s, PhD |
| Experience Level | Internship |
Requirements
- Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
- 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog etc.
- Must be available for 11 – 14 weeks during Summer 2025 (May-September) with a graduation date of December 2025 or later
Responsibilities
- Leverage electrical and/or computer engineering degree to work on Qualcomm multi-disciplinary teams such as System, Front-end Design, Implementation, Design-for-Test, Physical Design, Pre-silicon Verification, Emulation, Post-silicon Validation, CAD, GPU Design, and Machine Learning.
Preferred Qualifications
- Candidates actively pursuing a degree with an anticipated graduation within the upcoming year preferred Dec 2025 to June 2026.
- Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field
- Candidates with academic or professional experience in one or more of the following technical tracks: GPU, CPU, Digital Design/DV, SoC SYSTEMS.