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Advanced Packaging Modeling Engineer

Advanced Packaging Modeling Engineer

CompanyGlobalFoundries
LocationMalta, NY, USA
Salary$94300 – $175100
TypeFull-Time
DegreesMaster’s, PhD
Experience LevelSenior

Requirements

  • M.S. + minimum of 5 years of relevant experience
  • PhD + minimum of 3 years of relevant experience
  • Semiconductor mechanical or thermal or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications
  • Must have at least an overall 3.0 GPA and proven good academic standing
  • Language Fluency – English (Written & Verbal)
  • Solid understanding of semiconductor processes and integration techniques
  • Good computer / software skills
  • Ability to clearly present results to small and large groups

Responsibilities

  • Familiarity with commercial software for mechanical or thermal or electrical modeling
  • Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling
  • Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling
  • Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3DHI technology decisions
  • Apply commercial simulation software to mimic semiconductor process flows and highlight the areas of concern
  • Extensive interaction with integration, device, and design engineers to assure development of a working technology
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
  • Other duties as assigned by manager

Preferred Qualifications

  • PhD + 5 years of relevant experience
  • Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…)
  • Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity
  • Strong written and verbal communication skills
  • Strong planning & organizational skills