Advanced Package Technology Engineer
| Company | Broadcom Limited |
|---|---|
| Location | San Jose, CA, USA, Fort Collins, CO, USA |
| Salary | $119000 – $190000 |
| Type | Full-Time |
| Degrees | Master’s, PhD |
| Experience Level | Senior, Expert or higher |
Requirements
- Master’s Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 10+ years of relevant experience
- 4~6 years Hands On experience in 2.5D / 3D Development
- In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions
- Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems
- Good team player with project management, analytical, problem-solving and interpersonal skills
- Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization
- Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations
Responsibilities
- Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution
- Lead in identification, development & qualification; program management with external assembly partners
- Lead in memory supplier(s) engagement to define technology and quality requirements
- Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team
- Support new design wins, NPI and volume ramps
- Develop alternate sourcing & qualification
Preferred Qualifications
-
No preferred qualifications provided.