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Staff Mechanical Engineer – Trap Control
| Company | IonQ |
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| Location | Hyattsville, MD, USA |
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| Salary | $123191 – $161289 |
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| Type | Full-Time |
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| Degrees | Bachelor’s |
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| Experience Level | Senior, Expert or higher |
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Requirements
- Bachelor’s degree in Mechanical Engineering or a related field
- 5+ years of professional experience or an equivalent combination of education and experience
- Minimum of 3 years of experience in mechanical design, with a focus on electronic packaging and enclosure design
- Proficiency in 3D CAD software (e.g., SolidWorks)
- Understanding of material properties, manufacturing processes, and assembly techniques relevant to electronic enclosures
- Familiarity with thermal management principles for electronic devices
Responsibilities
- Design and develop mechanical enclosures and packaging for electronic assemblies, considering factors such as thermal management, EMI/RFI shielding, vibration and shock resistance, and manufacturability.
- Create detailed 3D CAD models and 2D drawings of enclosures, components, and assemblies using software such as SolidWorks.
- Perform structural and thermal analysis (FEA/CFD) to ensure design integrity and performance under various operating conditions.
- Select appropriate materials and manufacturing processes (e.g., injection molding, sheet metal fabrication, die casting) based on performance requirements, cost, and production volume.
- Work closely with electrical engineers to ensure proper integration of electronic components, cable routing, and connector placement within the enclosure.
- Develop and execute testing protocols to validate the mechanical integrity, thermal performance, and environmental resilience of enclosures and packaging.
- Generate detailed Bill of Materials (BOMs) and documentation for manufacturing.
- Participate in design reviews and provide constructive feedback.
Preferred Qualifications
- 10+ years of experience in mechanical design with a focus on electronic packaging
- Experience with FEA and CFD software for structural and thermal analysis (e.g., ANSYS, COMSOL)
- Experience with micro-electronic packaging
- Knowledge of EMI/RFI shielding techniques and design considerations
- Experience with designing for precision instrumentation in laboratory environments
- Familiarity with rapid prototyping techniques (e.g., 3D printing)
- Experience with product lifecycle management (PLM) systems
