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Principal Design Engineer

Principal Design Engineer

CompanyRTX
LocationMassachusetts, USA
Salary$101000 – $203000
TypeFull-Time
DegreesBachelor’s, Master’s
Experience LevelSenior, Expert or higher

Requirements

  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior work experience, or an Advanced Degree in a related field and minimum 5 years of prior work experience.
  • Experience with software using Siemens Mentor Graphics and BluePrint.
  • Design layout experience including Rigid, Flex, and Rigid-Flex assemblies.
  • Experience with Analog, Digital including DDR, RF, Power, and mixed signal technology, including multi-layer designs with High Density Interconnect (HDI) technology.
  • Experience with Xpedition Library Manager Symbol / Padstack / Cell creation / manipulation.
  • Experience with Valor NPI, Design for Manufacturing rule sets.
  • U.S. Person (U.S. citizen, permanent resident, refugee or asylee) are eligible to obtain necessary export authorizations required.

Responsibilities

  • Printed Circuit Board (PCB) designs from conception to manufacturing for RF applications.
  • Creation of the PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliers.
  • Working designs include full designs, re-spins, simple tasks, change notices, and process improvement projects within and outside own discipline.
  • On daily basis, interface with many different engineering levels and multi-disciplined engineering groups including, but not limited to Electrical, Mechanical, and Producibility Engineering disciplines to ensure that the overall design requirements are captured and accomplished.
  • Your top priority is to support engineering customers affiliated with home department.

Preferred Qualifications

  • Familiarity with IPC 6012 & IPC 6013.
  • Working knowledge of military and commercial design standards, GD&T techniques, and overall producibility considerations related to electronic packaging.
  • Experience with laying out advanced MMIC Wire-bondable / Cavity RF Modules, Reusable Blocks and Translations from CAD vendor’s into Xpedition.
  • Strong customer interaction skills with engineers of all levels within and outside of their own discipline.
  • Self-starter with the ability to work autonomously while establishing schedule and priority needs.
  • Proactivity in own discipline and beyond with minimal supervision.
  • Ability to effectively multi-task and to make improvements of processes, systems, or products to enhance performance of the work area.
  • Able to understand and interpret drawings as they relate to PCB’s.
  • Able to assist in developing technical solutions to complex problems using ingenuity and creativity with minimum supervision.