Design Engineer – Senior Director

Master’s degree in Electrical Engineering, Physics, or a related field
Proven experience in IC packaging design, with expertise in 3D packaging technologies and methodologies
Proficiency in CAD software and simulation tools (e.g. SPICE, Sigrity, ANSYS-EM, Cadence Allegro, IBIS, Scripting)
Understanding of materials used in semiconductor packaging and their properties
Strong analytical skills and attention to detail to ensure high-quality and reliable designs
Excellent communication and collaboration skills to work effectively in a team environment

Create and develop 3D packaging designs for ICs, ensuring optimal performance, thermal management, and reliability
Utilize simulation tools to analyze the electrical, thermal, and mechanical performance of package designs
Work closely with cross-functional teams, including chip designers, system engineers, and manufacturing teams, to ensure package designs meet specifications and integration requirements
Oversee the prototyping process to validate designs through testing and iterations
Prepare detailed documentation for design specifications, test plans, and design reviews
Stay updated on industry standards, materials, and technologies relevant to 3D IC packaging
Identify and address design-related issues and challenges throughout the development process
Manage timelines and deliverables for packaging design projects, ensuring timely completion

Relevant certifications in IC design or packaging may be an advantage
Familiarity with advanced tools and methodologies in 3D IC design and packaging
Experience in R&D projects related to new packaging technologies or applications